Reduce HDI construction by adapting smaller pitch devices to larger footprints .Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements)
Adapt to fine pitch footprints including TSSOPs and QFP's with pitches down to 0.4mm
Correct-A-Chip™ technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts
Convert surface-mount QFP packages to a 13x13 PGA footprint
Convert surface-mount PQFP packages to an Amp interstitial PGA footprint.Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs
To see more adapters that we can offer from Aries "Correct A Chip" range, please use this link.