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Burn in Sockets

Burn in Sockets

Burn-In Test sockets for IC Package Styles; CSP, ÂĩBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and Any and All SMT Package Styles made With or Without Leads. Can also be compatible with PGA packaged devices.