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Correct A Chip Adapters

Correct A Chip Adapters

Correct-A-Chip Adaptors allow you to replace and existing chip with another one which has a different footprint without the need to change your board layout. Saves time, money and gets your product to market quickly.

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  • 23016

    BGA

    BGA Switch-A-Pitch Adapters. Reduce HDI construction by adapting smaller pitch devices to larger footprints â€ĸ Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements) â€ĸ Enable the use of standard line and trace spacing â€ĸ Eliminate the need for laster-drilled microvias motherboards..

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  • 23016

    Correct-A-Chip

    Correct-A-Chipâ„ĸ Socket with Collet Contacts. Correct-A-Chipâ„ĸ technology solves problems associated with the use of alternate ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs. â€ĸ Available with either 0.300 [7.62] or 0.600 [15.24] row-to-row spacing...

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  • 23016

    Dip to SOIC

    High-Temperature SOIC-to-DIP Adapter – Series 350000-10-HT. A cost-effective means of upgrading to SOIC without changing your PCB layout Available on 0.300 [7.62] centers For Adapters on 0.400 [10.16], or 0.600 [15.24] centers, consult Data Sheet 18011..

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  • 23016

    Fine Pitch

    Fine Pitch Bump Adapters. â€ĸ Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm â€ĸ Features raised connection pads up to 0.010" â€ĸ Available in tape and reel for high speed SMT assembly â€ĸ Can be manufactured for RoHS compliance..

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  • 23016

    PQFP to PGA

    P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket. Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. â€ĸ Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. â€ĸ Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. â€ĸ Consult factory for Panelized Form or for mounting of consigned chips...

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  • 23016

    QFP to PGA

    P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch. Convert surface-mount QFP packages to a 13x13 PGA footprint. â€ĸ Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. â€ĸ Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. â€ĸ Consult factory for Panelized Form or for mounting of consigned chips...

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